Leaked Intel Crescent Island PCB Surfaces with Xe3P GPU, 160 GB LPDDR5X and 16-Pin Power

A PCB leak from YuuKi_AnS has given us the first look at Intel's Crescent Island PCIe accelerator and a few things stand out immediately. The Xe3P GPU die is visibly larger than the Xe2-based BMG-G31 in the current Intel Arc lineup. Xe3P is the architecture following the current Xe3. While Xe3 is heading to client products under the Arc C-Series branding, Xe3P is being positioned as a more scalable design that covers client iGPUs all the way up to data center inference. Memory is the other talking point confirming previous rumors by leaker Jaykihn from April. Rather than HBM, Intel is going with LPDDR5X, the PCB showing 20 memory sites in total, 12 on the front and 8 on the back, each carrying 8 GB for a total of up to 160 GB. This is a deliberate choice made by Intel to sidestep the HBM supply issues while keeping costs down, though LPDDR5X trades bandwidth for lower pricing compared to HBM standards.

The rest of the PCB shows 13 populated VRM stages out of 18 total positions, and power comes in via a single 16-pin connector on the back of the board. A USB Type-C port on the side appears to be for engineering and testing purposes rather than a production feature. Intel Crescent Island GPUs are still a few months out, but the leaked PCB looks close to a final design according to the source. However, no gaming variant is expected based on current rumors. The company recently introduced the Arc Pro B70 and B65 professional cards based on Battlemage Xe2 silicon, while rumors surrounding a higher-end Arc B770 gaming model have largely gone quiet ahead of Computex.