Intel 14A Node Enters Risk Production in 2028, 10A and 7A Nodes on the Roadmap

Intel CEO Lip-Bu Tan spoke at the J.P. Morgan TMT Conference, providing more details about the company's roadmap for future node developments. According to Lip-Bu Tan, Intel now forecasts the 14A node risk production run in 2028, with high-volume manufacturing in 2029. This is expected to coincide with major customers ramping up their designs and starting to ship 14A silicon worldwide. Intel plans to utilize the node both internally and offer it to third-party customers, who will consume High-NA EUV exposed wafers at scale. Interestingly, the Intel CEO notes that this timeline is very similar to TSMC's A14 node, which is expected to be a direct competitor to Intel's 14A in the angstrom era of semiconductor manufacturing.

We have already reported on the progress Intel is making with 14A, noting that the node is advancing at a much better pace than Intel experienced with the 18A node. This means better yields at early stages, less complex manufacturing, and an overall improved production process. Notably, 14A is the first semiconductor node globally to utilize ASML's High-NA EUV lithography tools, which are the most sophisticated chip manufacturing machines ever designed. The 14A node is currently at the 0.5 PDK stage, and customers will finalize volume, design, and other requirements when the PDK 0.9 is released. Lip-Bu Tan expects this 0.9 PDK, which he refers to as a "holy grail," to be available in October of this year, allowing customers to start their designs.