MediaTek Says Its Next-Gen Program Will Only Use Intel’s EMIB-T For Packaging

Jun 02, 2026 - 12:04
Updated: 3 hours ago
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MediaTek Says Its Next-Gen Program Will Only Use Intel’s EMIB-T For Packaging

A MediaTek chip glowing on a circuit board with a visible 'MediaTek' logo.

Taiwanese fabless semiconductor firm MediaTek has made a major claim at the Goldman Sachs Taiwan Day by outlining that for its next-generation program, it plans to only use Intel's EMIB-T packaging technology. The Taiwanese supply chain has been discussing EMIB-T regularly for months now, and MediaTek is Google's partner for the next-generation TPU custom AI chips. Intel has positioned EMIB against TSMC's CoWoS packaging technology, and MediaTek's announcement marks a strategic win for the American chip company, whose CEO has aggressively targeted the AI industry as part of his turnaround efforts. Intel Might Have Won MediaTek Over From TSMC's CoWoS […]

Read full article at https://wccftech.com/mediatek-says-its-next-gen-program-will-only-use-intels-emib-t-for-packaging/

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Christopher Holloway

Christopher Holloway is the founder and director of Progressive Robot, a UK-based technology company. A full-stack engineer with more than two decades of experience, he works across PHP development, ecommerce, Linux infrastructure, technical SEO and AI automation, and writes here on technology, AI, hardware and software.

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