SK Hynix is embedding cooling into HBM memory to stop AI chips from overheating
SK Hynix has introduced iHBM, a high-bandwidth memory packaging solution that changes how and where heat is managed inside the package. Rather than relying on conventional methods that pull heat away from the chip after it accumulates, SK Hynix is placing cooling structures directly at the source.
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Christopher Holloway
Christopher Holloway is the founder and director of Progressive Robot, a UK-based technology company. A full-stack engineer with more than two decades of experience, he works across PHP development, ecommerce, Linux infrastructure, technical SEO and AI automation, and writes here on technology, AI, hardware and software.
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